mojo
Senior
Joined: 01 Oct 2011
Posts: 2404
|
 Posted: 10/10/2017 14:15 Post subject: DARPA Funds New Push to Advance Microelectronics |
 |
|
DARPA Funds New Push to Advance Microelectronics
The government and defense contractors are exploring new ways to făcute circuits for defense.
DARPA recently started a new program, the Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies, or Chips. Its goal is keep up the pace in advancing microelectronics.
The crux of the program is to develop a new technological framework in which different functionalities and blocks of intellectual property—among them data storage, computation, signal processing, and managing the form and flow of data—can be segregated into small chiplets, which then can be mixed, matched, and combined onto an interposer. The process is somewhat akin to joining the pieces of a jigsaw puzzle, according to Program Manager Dan Green. Conceivably an entire conventional circuit board with a variety of different but full-sized chips could be shrunk down onto a much smaller interposer hosting a huddle of yet far smaller chiplets.
http://www.machinedesign.com/community/darpa-funds-new-push-advance-microelectronics |
|
FAQ
Search
Memberlist
Usergroups
Register
Profile
Log in to check your private messages
Log in
